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AI SWITCHES
AI SWITCHES
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AI SWITCHES

Product Features
The Edgecore AIS800-32O is a cutting-edge 25.6 Terabit AI switch designed for next-generation high-performance data centers. Featuring 32x 800G OSFP800 ports powered by Broadcom's Tomahawk 5 silicon,
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Detailed Introduction


FEATURES & BENEFITS

  • OSFP800 switch ports, each supporting 1x 800 GbE (100G PAM4), or via breakout cables 2x 400G GbE, 4x 200 GbE, or 8x 100 GbE.
  • OSFP800 switch ports also support 1x 400 GbE (50G PAM4), 1x 100 GbE (NRZ), and via breakout cables 2x 200 GbE, 4x 100 GbE, or 8x 50 GbE.
  • Up to 30W power budget per OSFP800 port.
  • Incorporates Broadcom Tomahawk 5 switch series silicon.
  • Highest Radix: Up to 160 logical interfaces on a single chip, low latency
  • Cognitive/Adaptive routing and Dynamic Load Balancing (DLB) and Global Load Balancing (GLB)
  • Advanced shared buffering
  • Programmable in-band telemetry
  • Supports end-to-end congestion control
  • Power efficient due to a monolithic 5nm die
  • Hardware-based link failover for network resiliency and reduced job completion time
  • Support for SRv6
  • Support for VxLAN RIOT
  • BMC module with serial-over-LAN support

TECHNICAL SPECIFICATIONS

Switch Ports32 x OSFP800 800GbE
Switch SiliconBCM78902 Tomahawk 5
ProcessorIntel® Xeon® Quad-Core 2.2 GHz
BMCAST2620 with OpenBMC secured by AST1060 Root of Trust
SPI Flash64MB x 2
Memory32GB DDR4 SO-DIMM with ECC
Storage240GB m.2 2280 NVMe SSD
TPMTPM2.0 SPI
Rack1 RU form factor
Timing and Sync(Optional) 1PPS Port, 10 MHz port, ToD port, SyncE, IEEE 1588v2 PTP
Fans7 Hot-swappable fan modules with 6+1 redundant fans
Storage Temperature-40°C to 70°C
Operating Temperature0° C ~ 40° C (Front-to-Back)0° C ~ 35° C (Back-to-Front)