Intel's Silicon Photonics Paves the Way for 1.6T Optical Modules, Targeting Next-Generation Data Centers

As the demand for higher bandwidth in data centers continues to surge, 1.6T optical modules have entered the commercial stage, becoming a key enabler for next-generation Ethernet switch capacities. These modules are now available in various form factors, including QSFP-DD and OSFP, with the latter emerging as the preferred platform for 1.6T solutions due to its superior thermal and power efficiency.

Intel, a pioneer in silicon photonics, is driving innovation in this space with its highly integrated approach. Traditional 400GBASE-DR4 modules rely on labor-intensive assembly of discrete components such as lasers (EML), lenses, and isolators. In contrast, Intel’s silicon photonics technology bonds indium phosphide (InP)-based chiplets onto 300-mm silicon wafers, enabling wafer-scale manufacturing of lasers and other optical components. This integration reduces complexity, cost, and alignment challenges while improving scalability.

A notable example is Intel’s 1.6T 2×FR4 Photonic Integrated Circuit (PIC) architecture. Similar to the 800G 2×FR4 design, this solution incorporates eight high-speed Mach-Zehnder Modulators (MZMs) operating at 200 G per lane, simplifying the implementation of 1.6T optical modules in OSFP packages. Furthermore, by leveraging the OSFP-XD platform with two such PICs, capacities of up to 3.2T can be achieved, highlighting the scalability of this technology.

Power efficiency remains a critical focus. While theoretical calculations suggest a power consumption of around 27.2 W for a 1.6T module (based on 17 pJ/bit energy efficiency), actual 1.6T OSFP modules have demonstrated remarkable optimization, consuming as low as 14 W. This represents a 35–60% reduction compared to Co-Packaged Optics (CPO) alternatives, making pluggable modules a compelling choice for data center operators.

In addition to power savings, material innovations such as thin-film lithium niobate modulators are extending transmission distances to 2 km, addressing the growing need for longer-reach interconnects within and between data centers.

Intel’s advancements in silicon photonics not only enhance the performance and feasibility of 1.6T optical modules but also reinforce the industry’s transition toward higher-density, energy-efficient, and scalable connectivity solutions. As data centers prepare for 1.6T and beyond, Intel’s integrated photonics approach is poised to play a pivotal role in shaping the future of high-speed networking.