04-01 , 2026
2026: The First Year of Commercialization for CPO & the Boom Year of Optical Interconnect Technology
With the mass production and deployment of NVIDIA's GB200/300 NVL72 full-rack systems, as well as the release and development of the Vera Rubin NVL72 platform, Scale-Up (intra-rack chip interconnection) and Scale-Out (large-scale cross-rack interconnection) have become core topics in data center arc... ...